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FLX-3300-R Automated Stress Measurement
Precision Surface Stress Analysis
With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films. In-situ stress measurements can be made from -65°C to 500°C at heating rates up to 30°C per minute (the cooling unit to -65°C is optional). An understanding of stress variations with temperature is essential for characterizing material properties such as stress relaxation, moisture evolution, and phase changes.
Toho FLX-3300-R Thin Film Stress Measurement Systems offer industry standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates up to 300mm in diameter. Incorporating KLATencor’s patented “Dual Wave-length” technology, Toho FLX Series tools determine and analyze surface stress caused by deposited thin films. The Toho FLX systems offer out-standing value in a variety of comprehensive Stress Measurement Solutions.
In general, stress is induced when materials of dissimilar coefficients of thermal expansion are bonded together. Films may behave similarly at high temperatures but as films are cooled, materials may contract / expand differently, thus causing stress in the film.
With a stressed film, defects such as dislocations, voids, and cracking may occur. The FLX stress measurement system helps troubleshoot applications listed below:
• Aluminum stress-induced voids
• Passivation cracking (nitride/oxide)
• Stress-induced dislocations in Si
• Tungsten Silicide cracking
• Stress increase in oxides during temperature cycling
• Matching metallization expasion on GaAs
• Si cracking due to high film stress
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