FLX 3300-T Thermal Measurement System

With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films. In-situ stress measurements can be made from -65°C to 500°C at heating rates up to 30°C per minute (the cooling unit to -65°C is optional). An understanding of stress variations with temperature is essential for characterizing material properties such as stress relaxation, moisture evolution, and phase changes.