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Digital Selected Area Preparation System

Product Highlights

  • Suits all sizes of die - package, wafer and board-level
  • Full 100mm x 100mm stage area
  • Always-On Real Time Video Monitor showing system and naviation parameters
  • Touchscreen control with physical joystick & controls
  • Rigid Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
  • X, Y and Z axes all have deep sub-micron accuracy
  • Accurately decaps, then thins substrate and polishes
  • Patented Floating Head provides a true polishing action -- yields polishing quality & high survivability
  • Intuitive menus provide a powerful, easy to use, system
  • USB Flash Drive interface for preparation recipe storage
  • Short set-up and process times
  • Accurate die-tilt adjustment ‘on the fly’
  • Bench-top & Quiet in Operation

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